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Precision Perfected: Your Solution for High-Density & Complex PCBA Manufacturing -Hitech Circuits

In the relentless pursuit of smaller, faster, and more powerful electronic devices, the complexity of Printed Circuit Board Assemblies (PCBA) has escalated dramatically. Modern designs demand the integration of countless components into minimal space, featuring ultra-fine pitches and advanced packaging technologies.


Not all manufacturers can keep pace with these stringent demands. You need a partner with proven expertise and the cutting edge technology to handle the most intricate designs.


Mastering Complexity: Our Advanced PCBA Capabilities

We specialize in high-density interconnect (HDI) and complex surface mount technology (SMT) assembly. Our facilities are engineered to manage the detailed requirements of next-generation electronics:


1. Expertise in Advanced Component Placement


We have the precision equipment and engineering know-how to reliably place and solder a wide array of sophisticated components:

BGA (Ball Grid Array), QFN (Quad Flat No-leads), QFP (Quad Flat Package): We excel in assembling these fine-pitch, high-I/O components, which are critical for microprocessors, memory, and communication chipsets.

Minimal Component Sizes: Our automated pick-and-place lines support ultra-miniaturized components down to 01005 (and even 008004 upon request), enabling extreme density and miniaturization in your designs.

Fine Pitch Capability: We maintain high precision for components with pitches as fine as 0.3mm, ensuring accurate alignment and reliable solder joints for even the most challenging parts.


2. Advanced Assembly Techniques


Handling high component density requires more than standard SMT. We utilize comprehensive techniques to ensure flawless execution:

Double-Sided SMT Assembly: Maximizing board real estate by efficiently utilizing both sides of the PCB.

Hybrid Assembly (SMT & Through-Hole): Seamlessly integrating traditional components with modern surface-mount parts using selective soldering for optimal quality.

HDI Board Capabilities: Expertise in boards utilizing microvias, blind/buried vias, and sequential lamination, allowing for higher routing density and improved signal integrity.


3. Rigorous Quality Assurance


Precision assembly is verified by meticulous inspection. We employ multi-stage testing protocols to ensure zero defects:

AOI (Automated Optical Inspection): High-speed verification of component placement and solder joint quality.

X-ray Inspection: Essential for checking hidden solder joints underneath BGA, QFN, and CSP components to detect critical defects.

ICT (In-Circuit Testing) & FVT (Functional Verification Testing): Ensuring every board not only looks perfect but performs exactly as designed.


Why Partner With Us?


We understand the pressures of the modern market. Our robust capabilities and commitment to engineering excellence mean we can handle your most material-intensive and complex projects, delivering reliable results on time.

We are equipped to handle your most demanding designs and density requirements.


Take the Next Step


Don't let manufacturing limitations constrain your innovation. Partner with a leader in high-density PCBA assembly.

Contact us today to discuss your complex project and receive a custom quotation.

Experience the pinnacle of PCBA precision and performance.


Mobile/Whatsapp/Skype:+86 18033052718

Website: www.hitechpcba.com

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