As electronic devices continue to shrink in size while increasing in complexity, ultra-small PCBA manufacturing has become one of the most demanding capabilities in modern electronics production. We recently demonstrated our advanced manufacturing capability by successfully assembling a 15mm × 4.5mm ultra-compact PCB with a 4mm × 4mm BGA package component, achieving high precision placement and stable soldering quality under extreme space constraints. Engineering Challenge: E

In today’s rapidly evolving electronics industry, the demand for high frequency PCB and high speed signal transmission continues to grow, especially in applications such as 5G communication, RF systems, automotive radar, and advanced computing devices. To meet these challenges, combining RF PCB technology with BGA via-in-pad plating has become a critical solution for achieving compact design, signal integrity, and high reliability. What is Via-in-Pad Plating for BGA? Via-in-p